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Provisional Data Sheet No. PD-9.432B
HEXFET
(R)
JANTX2N6800 POWER MOSFET JANTXV2N6800 [REF:MIL-PRF-19500/557] [GENERIC:IRFF330]
N-CHANNEL Product Summary
Part Number JANTX2N6800 JANTXV2N6800 BVDSS 400V RDS(on) 1.0 ID 3.0A
400 Volt, 1.0 HEXFET
HEXFET technology is the key to International Rectifier's advanced line of power MOSFET transistors. The efficient geometry achieves very low onstate resistance combined with high transconductance. HEXFET transistors also feature all of the well-establish advantages of MOSFETs, such as voltage control, very fast switching, ease of paralleling and electrical parameter temperature stability. They are well-suited for applications such as switching power supplies, motor controls, inverters, choppers, audio amplifiers, and high energy pulse circuits, and virtually any application where high reliability is required.
Features:
s s s s s
Avalanche Energy Rating Dynamic dv/dt Rating Simple Drive Requirements Ease of Paralleling Hermetically Sealed
Absolute Maximum Ratings
Parameter
ID @ V GS = 10V, TC = 25C I D @ VGS = 10V, TC = 100C IDM PD @ TC = 25C VGS dv/dt TJ TSTG Continuous Drain Current Continuous Drain Current Pulsed Drain Current Max. Power Dissipation Linear Derating Factor Gate-to-Source Voltage Peak Diode Recovery dv/dt Operating Junction Storage Temperature Range Lead Temperature Weight
JANTX2N6800, JANTXV2N6800 Units
3.0 2.0 12.0 25 0.20 20 4.0 -55 to 150 300 (0.063 in. (1.6mm) from case for 10.5 seconds) 0.98 (typical)
oC
A
W W/K V V/ns
g
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Electrical Characteristics @ Tj = 25C (Unless Otherwise Specified)
Parameter
BVDSS Drain-to-Source Breakdown Voltage BVDSS /TJ Temperature Coefficient of Breakdown Voltage RDS(on) Static Drain-to-Source On-State Resistance VGS(th) Gate Threshold Voltage gfs Forward Transconductance IDSS Zero Gate Voltage Drain Current
Min.
400 -- -- -- 2.0 2.0 -- -- -- -- 19.1 1.0 6.7 -- -- -- -- --
Typ. Max. Units
-- 0.37 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 5.0 -- -- 1.0 1.15 4.0 -- 25 250 100 -100 33 5.8 19.9 30 35 55 35 -- V V/C V S( ) A nA nC
Test Conditions
VGS = 0V, ID = 1.0 mA Reference to 25C, ID = 1.0 mA VGS = 10V, ID = 2.0A VGS = 10V, ID = 3.0A VDS = VGS, ID = 250A VDS > 15V, IDS = 2.0A VDS = 0.8 x Max Rating,VGS = 0V VDS = 0.8 x Max Rating VGS = 0V, TJ = 125C VGS = 20V VGS = -20V VGS = 10V, ID = 3.0A VDS = Max. Rating x 0.5 see figures 6 and 13 VDD = 200V, ID = 3.0A, RG = 7.5, VGS = 10V see figure 10
Measured from the Modified MOSFET drain lead, 6mm (0.25 symbol showing the in.) from package to internal inductances. center of die. Measured from the source lead, 6mm (0.25 in.) from package to source bonding pad.
IGSS IGSS Qg Qgs Qgd td(on) tr td(off) tf LD
Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Internal Drain Inductance
ns
LS
Internal Source Inductance
--
15
--
nH
Ciss Coss Crss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
-- -- --
620 200 75
-- -- --
pF
VGS = 0V, VDS = 25V f = 1.0 MHz see figure 5
Source-Drain Diode Ratings and Characteristics
Parameter
IS I SM Continuous Source Current (Body Diode) Pulse Source Current (Body Diode)
Min. Typ. Max. Units
-- -- -- -- 3.0 12.0
Test Conditions
Modified MOSFET symbol showing the integral reverse p-n junction rectifier.
A
VSD t rr Q RR t on
Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time
Tj = 25C, IS = 3.0A, VGS = 0V Tj = 25C, IF = 3.0A, di/dt 100A/s VDD 50V Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L S + LD. -- -- -- -- -- -- 1.4 700 6.2 V ns C
Thermal Resistance
Parameter
RthJC RthJA Junction-to-Case Junction-to-Ambient
Min. Typ. Max. Units
-- -- -- -- 5.0 175 K/W
Test Conditions
Typical socket mount
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Fig. 1 -- Typical Output Characteristics TC = 25C
Fig. 2 -- Typical Output Characteristics TC = 150C
Fig. 3 -- Typical Transfer Characteristics
Fig. 4 -- Normalized On-Resistance Vs.Temperature
Fig. 5 -- Typical Capacitance Vs. Drain-to-Source Voltage
Fig. 6 -- Typical Gate Charge Vs. Gate-to-Source Voltage
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Fig. 7 -- Typical Source-to-Drain Diode Forward Voltage
Fig. 8 -- Maximum Safe Operating Area
Fig. 9 -- Maximum Drain Current Vs. Case Temperature
Fig. 10a -- Switching Time Test Circuit
Fig. 10b -- Switching Time Waveforms
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Fig. 11 -- Maximum Effective Transient Thermal Impedance, Junction-to-Case Vs. Pulse Duration
Fig. 12a -- Unclamped Inductive Test Circuit
Fig. 12b -- Unclamped Inductive Waveforms
Fig. 13a -- Gate Charge Test Circuit
Fig. 13b -- Basic Gate Charge Waveform
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JANTX2N6800, JANTXV2N6800 Device
Repetitive Rating; Pulse width limited by
maximum junction temperature. (see figure 11) @ VDD = 50V, Starting TJ = 25C, EAS = [0.5 * L * (I L2) * [BV DSS/(BVDSS-VDD)] Peak IL = 3.0A, VGS = 10V, 25 RG 200
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I SD 3.0A, di/dt 90A/s, Pulse width 300 s; Duty Cycle 2% K/W = C/W
W/K = W/C VDD BVDSS, T J 150C
Case Outline and Dimensions -- TO-205AF (Modified TO-39)
All dimensions are shown millimeters (inches)
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111 IR FAR EAST: K&H Bldg., 2F, 3-30-4 Nishi-Ikeburo 3-Chome, Toshima-Ki, Tokyo Japan 171 Tel: 81 3 3983 0086 IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371 http://www.irf.com/ Data and specifications subject to change without notice. 10/96
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